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RS series I/O helps semiconductor industry develop and apply adhesive more precisely!

 sumber daya perusahaan tentang RS series I/O helps semiconductor industry develop and apply adhesive more precisely!

Decowell RS series modules have strong anti-interference ability, which can help us precisely regulate all kinds of parameters, ensure stable data transmission, and work efficiently and smoothly with PLC, which gives us a solid guarantee for the accuracy and efficiency of developing and applying adhesive.

1Industry Analysis: Developing and gluing

 

In the semiconductor, PCB, and other electronic manufacturing fields, developing and applying adhesives is an indispensable process. Developing removes the exposed portion of the photoresist to form a precise pattern on the substrate, while gluing evenly covers the substrate surface with a layer of photoresist in preparation for subsequent lithography steps. The precision and stability of these two steps directly determine the line accuracy, electrical performance, and other key indicators of the final product.

 

RS series I/O helps semiconductor industry develop and apply adhesive more precisely!

 

With the development of electronic products toward miniaturization and high performance, the development and coating process faces many challenges. On the one hand, the uniformity of coating thickness and pattern precision requirements is getting higher and higher, and traditional equipment is difficult to meet the demand for high-precision production; on the other hand, the production efficiency and stability of the equipment are also important factors restricting the development of the industry.

2. On-site Pain Points RS series is easy to solve

 

In actual production, the traditional developing and gluing equipment used by many enterprises has revealed a series of problems.

 

Pain point 1: Cannot be accurately controlled

 

In the actual development and gluing process, a single station often requires a mixture of digital and analog, and the compatibility of the module is extremely high. In some high-precision chip manufacturing, even a small thickness deviation may lead to chip performance degradation or even scrap.

RS series: Adopting a split design, any panel can be selected. The long base is well designed to support the simultaneous operation of two slots, which is perfectly compatible with the mixed use of digital and analog.

 

RS series I/O helps semiconductor industry develop and apply adhesive more precisely!

 

This means that when dealing with complex developing and gluing tasks, it is able to accurately regulate all kinds of parameters, such as realizing the precise positioning of gluing position through accurate digital control, and finely adjusting the flow and speed of gluing by using the continuously changing characteristics of analog quantity, which greatly enhances the precision of developing and gluing and successfully adapts to the stringent requirements of high precision on the process side.

 

Pain point 2: Low efficiency

 

The slow running speed and long production cycle of the equipment cannot meet the demand of mass production. Especially when the market demand is strong, the lack of production capacity becomes a bottleneck for the development of enterprises.

 

RS series:

1. Data transmission speed up to 100Mbps, stable and reliable signal transmission, response time within 11μs, equipment operating speed compared to traditional equipment increased by 50%, greatly improving production efficiency.

 

2. Split design, flexible configuration, provides an efficient and reliable solution for modern industrial automation.

RS series I/O helps semiconductor industry develop and apply adhesive more precisely!

Pain point 3: Poor stability

 

Frequent equipment failures require a lot of maintenance and repair work, which not only increases production costs but also affects the smooth running of the production program.

 

RS series:

 

1. Adopting high-quality hardware components and a strict quality inspection process, its EMC test standard far exceeds the national standard, which can effectively resist electromagnetic interference and ensure the stability and reliability of the equipment in long-term operation.

2. With an advanced fault diagnosis system, it can monitor the status of the equipment in real time, warn of potential faults in advance, reduce the failure rate of the equipment, and reduce maintenance costs.

RS series I/O helps semiconductor industry develop and apply adhesive more precisely!

 

3. With a hot-plugging function, the module can be directly plugged and unplugged during the operation of the equipment without downtime, which greatly reduces the difficulty and cost of maintenance and improves the maintenance efficiency.

3. Decowell Solutions: Developing and gluing the control system

 

Siemens 1200 PLC combined with our RS series I/O modules constitutes a set of efficient developing and gluing control system. The system is capable of receiving various sensor signals, such as temperature sensors, humidity sensors, and coating thickness sensors, to monitor the environmental conditions and coating quality of the gluing process in real time.

 

RS series I/O helps semiconductor industry develop and apply adhesive more precisely!

 

Based on this data, the PLC precisely controls the loads, including the applicator's stirring motor, spraying system, and heating unit, to optimize the gluing effect and ensure coating uniformity and stability. Through this intelligent monitoring and control, the developer gluing process is able to increase productivity and ensure product quality.

 

Specific configuration:

Main station: Siemens PLC

Applicable process section: developing and gluing

Project I/O configuration: 1*RS-PN2+4*16DI+4*16DO+1*8AI

RS series I/O helps semiconductor industry develop and apply adhesive more precisely!